MATERIALS
Min finished thickness .003”
Max finished thickness .250”
Max PCB size 24.0” X 120”
Min dielectric thickness .003”
Finished thickness tolerance +/- 10%
Copper weights available (base/foil) 0.5, 1, 2 oz
DRILLING
Min finished hole size .006”
Min drilled size .010”
Max drilled size .250”
Max drilling aspect ratio 25:1
Hole location tolerance +/- .003”
PTH diameter tolerance +/- .003”
NPTH diameter tolerance +/- .002”
IMAGING
Min line/space (1/2-1 oz base Cu) .003”/.003”
Min line/space (2 oz base Cu) .005”/.005”
Registration tolerance (top to bottom) +/- .003”
FINISHES
Immersion Tin 15-70 µ”
Max plating aspect ratio 12:1
ETCHING
½ oz Copper +/- .001”
1 oz Copper +/- .001”
2 oz Copper +/- .001”
UV Soldermask
Soldermask registration tolerance +/- .0003”
Min soldermask clearance +/- .0003”
FABRICATION
Route edge to edge tolerance +/- .005″
Route hole/feature to edge tolerance +/- .005″
Rout min inside radius .015”